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Writer's pictureKhasha Ghaffarzadeh

3600ppi full color MicroLED, QD Display Teardowns, Laser equipment for microLEDs, LIFT technology and Materials, Monolithic integration

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides.

 

  • LIFT materials for precision placement of MicroLEDs | Terecircuits

  • Laser Equipment for Micro LED Displays Mass Production | Contrel

  • Full-Color Micro-LED Micro-Display A Revolutionary Technology for AR/XR industry | Raysolve

  • A peek inside QD-enabled displays | Palomaki Consulting

  • High-resolution 3600ppi full-color Silicon Display for AR glasses and HM | Sharp

 

To learn more about MicroLED, please join MicroLED Connect.

 

MicroLED Connect is the world’s first MicroLED Conference and Exhibition taking place on 25 & 26 September 2024 at the High Tech Campus in Eindhoven, Netherlands. Explore the preliminary agenda here.



 

Intro to LIFT materials for precision placement of MicroLEDs

Wayne Rickard, Terecircuits Corporation | February 2024


Here you can learn about the following key points:

  • MicroLED manufacturing process flow

  • Die cost per TV as a function of year and die size

  • Key challenges

  • Projection of penetration of different mass transfer technologies in the MicroLED market

  • Laser-Induced Forward Transfer

  • Overcoming heat, residue and placement accuracy issues

  • Conventional LIFT vs Mask Imaging

  • Addressing adjacency effects

  • Patterning and key properties of Terefilm (reactivity, transparency, etc)

  • Compatibility with laser transfer machines

  • Cost of ownership 

  • Roadmap



Intro to LIFT materials for precision placement of MicroLEDs  Wayne Rickard, Terecircuits Corporation TechBlick. Here you can learn about the following key points:  MicroLED manufacturing process flow  Die cost per TV as a function of year and die size  Key challenges  Projection of penetration of different mass transfer technologies in the MicroLED market  Laser-Induced Forward Transfer  Overcoming heat, residue and placement accuracy issues  Conventional LIFT vs Mask Imaging  Addressing adjacency effects  Patterning and key properties of Terefilm (reactivity, transparency, etc)  Compatibility with laser transfer machines  Cost of ownership   Roadmap

 

Key Laser Equipment for Micro LED Displays Mass Production

Weichung Ooi, Contrel


Here you can learn about the following key points:

  • Overview of key mass transfer technologies

  • Comparison of stamps vs laser transfer (LIFT)

  • LIFT vs LITB process

  • Selective mass repair with redundancy

  • Compatible backplanes

  • Processes, Machine and Technical Parameters (pitch, yield, process time per chip, min LED size, accuracy, repair yield)



Key Laser Equipment for Micro LED Displays Mass Production  Weichung Ooi, Contrel  Here you can learn about the following key points:  Overview of key mass transfer technologies  Comparison of stamps vs laser transfer (LIFT)  LIFT vs LITB process  Selective mass repair with redundancy  Compatible backplanes  Processes, Machine and Technical Parameters (pitch, yield, process time per chip, min LED size, accuracy, repair yield) TechBlick MicroLED Connect

 

Innovative Full-Color Micro-LED Micro-Display A Revolutionary Technology for AR/XR industry

Raysolve | November 2023


Here you can learn about the following key points:

  • AR/VR glasses

  • Why is microLED important for AR

  • Full-color monolithic integration 

  • Process steps from blue LED to QD to full-color display

  • Parameters of demonstrators 

  • Large-scale wafer bonding (8inch)

  • All-Semiconductor Standard Process

  • World's smallest full-color microLED with 7200 PPI and performance



Innovative Full-Color Micro-LED Micro-Display A Revolutionary Technology for AR/XR industry  Raysolve | November 2023  Here you can learn about the following key points:  AR/VR glasses  Why is microLED important for AR  Full-color monolithic integration   Process steps from blue LED to QD to full-color display  Parameters of demonstrators   Large-scale wafer bonding (8inch)  All-Semiconductor Standard Process  World's smallest full-color microLED with 7200 PPI and performance

 

A peek inside QD-enabled displays

Peter Palomaki, Palomaki Consulting | December 2022


Here you can learn about the following key points:

  • Tools for analyising and doing display tear downs

  • Video of optical film in QD TV

  • Look at Back Light Unit

  • Insight Quantum DOT film

  • Measuring TCL 5-Series (QD + Phosphor) including optical spectra 

  • Role of QD and YAG

  • Measuring Hisense U6G

  • Extruded QD part

  • Measurement of optical spectra for LED and QD

  • QD OLED (schematic and pixel view)



A peek inside QD-enabled displays  Peter Palomaki, Palomaki Consulting | December 2022  Here you can learn about the following key points:  Tools for analyising and doing display tear downs  Video of optical film in QD TV  Look at Back Light Unit  Insight Quantum DOT film  Measuring TCL 5-Series (QD + Phosphor) including optical spectra   Role of QD and YAG  Measuring Hisense U6G  Extruded QD part  Measurement of optical spectra for LED and QD  QD OLED (schematic and pixel view)

 

High-resolution 3600ppi full color Silicon Display for AR glasses and HM

Yasuaki Hirano, SHARP | November 2022


Here you can learn about the following key points:

  • Outdoor smart glass requirements

  • Comparison of smart glass light engines (LCOS, DLP, uOLED uLED, LBS)

  • Optical system of AR glass

  • Brightness and features of microLEDs

  • 1053 PPI full color silicon display (process process and key technical features, and SEM micrograph)

  • Cross talk reduction 

  • 3600 PPI Full Color Silicon Display with Cd-Free QDs (Device architecture and challenges, status, etc)

  • Roadmap and challenges



High-resolution 3600ppi full color Silicon Display for AR glasses and HM  Yasuaki Hirano, SHARP | November 2022  Here you can learn about the following key points:  Outdoor smart glass requirements  Comparison of smart glass light engines (LCOS, DLP, uOLED uLED, LBS)  Optical system of AR glass  Brightness and features of microLEDs  1053 PPI full color silicon display (process process and key technical features, and SEM micrograph)  Cross talk reduction   3600 PPI Full Color Silicon Display with Cd-Free QDs (Device architecture and challenges, status, etc)  Roadmap and challenges


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