The LED in micro LED displays: Are we neglecting the most importantcontributor for our industry to succeed?For many micro LED display applications, the LED is the single most expensive component. More importantly, any compromise in LED yield can lead to huge cost increases in subsequent manufacturing steps, to the point where production may not be economically viable. At the same time, the LED and display manufacturing steps are highly interdependent. In this masterclass we will discuss resulting technology choices and their economic implications: What are LED manufacturing strategies and which epiwafer material properties do they require? How do GaN-on-silicon, GaN-on-sapphire and AlInGaP compare, and should wafers be 100 mm or 300 mm in diameter? How does all this relate to the multitude of RGB strategies being pursued and what is the cumulative impact on LED efficiency, manufacturing complexity, yield and cost?

MicroLED Transfer technology is a critical step in microLED fabrication. It is also a challenging step since extremely large numbers of chips must be transferred at ultrahigh throughput rates with near zero defects.

To this end, multiple technology options have been developed, ranging from traditional pick-and-place to stamp printing to fluidic assembly to laser transfer and many others.

In this class, we seek to overview all the key emerging technology options, discuss the market trends and requirements, and offer an unbiased benchmarking of the status and prospects of different technology options.

Laser technology could play an important role in the MicroLED industry including in microLED mass transfer and selective transfer, microLED bonding and micoLED repair.

Here you will learn about
Various laser technologies and techniques applicable to mini- and microLED industry
Key current and future performance capabilities including throughput, yield, chip size, etc
Important limitations and benchmarking of laser solutions vs others

MicroLED manufacturing involves the production of millions of LED devices, and the transfer of these LEDs onto the display substrates.

Given the imperfect yield at nearly all stages of manufacturing from growth to transfer to bonding, a critical part of the manufacturing strategy is inspection and repair.

In this class, you will learn about:
Challenges in microLED production and challenges in identifying and repairing defects at various stages of production
PL and EL measurements
MicroLED sorting, binning and tagging
Manufacturing-ready technologies for inspection and repair of microLED at all stages of the production from wafer growth to transfer to bonding