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microLEDs: Market Data, Value Chain, Laser Printing, Laser Lift Off, Trimming, LIFT, Hybridization, Monolithic Integration

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides.


  1. Holst Center | Laser Die Transfer at Holst Centre

  2. Yole Intelligence | Status of the MicroLED Industry

  3. CEA | Key challenges for hybridizing GaN micro LEDs and CMOS circuits

  4. 3D-Micromac | Laser Technology for the Production of MicroLED

 

To learn more about MicroLED, please join MicroLED Connect.

 

MicroLED Connect is the world’s first MicroLED Conference and Exhibition taking place on 25 & 26 September 2024 at the High Tech Campus in Eindhoven, Netherlands. Explore the preliminary agenda here.



 

1. Laser Die Transfer and FAST-CT Process at Holst Centre

Holst Center | October 2023


Here you can learn about the following key points:

  • Miniaturization of LEDs

  • Yield and defect management

  • Laser Printing and the FAST-CT Process

  • Laser mass transfer from native wafer to substrate with Holst Centre's release stack

  • Current status/achievements of the technology including release speed, pitch, UPH, Yield, Accuracy, etc

  • Adaptive pitch and using 100% of wafer space

  • Comparison with other laser based solutions

  • Flip chip bonding

  • Laser printing and control of heat flux

  • Fine interconnect laser printing

  • Solder laser printing

  • Roadmap



1. Laser Die Transfer and FAST-CT Process at Holst Centre  Holst Center |  October 2023  Here you can learn about the following key points:  Miniaturization of LEDs  Yield and defect management   Laser Printing  and the FAST-CT Process  Laser mass transfer from native wafer to substrate with Holst Centre's release stack  Current status/achievements of the technology including release speed, pitch, UPH, Yield, Accuracy, etc  Adaptive pitch and using 100% of wafer space  Comparison with other laser based solutions  Flip chip bonding  Laser printing and control of heat flux  Fine interconnect laser printing  Solder laser printing   Roadmap

 

2. Status of the MicroLED Industry

Yole Intelligence |  November 2023


Here you can learn about the following key points:

  • Supply chain overview

  • Examples of manufacturing ramp-ups

  • Examples of products and prototypes on the market

  • OLED improvement and roadmap shifting the goal posts

  • Smartwatch display modules prices and technology for Apple

  • TV market: price adoption vs price

  • 4K TV Cost breakdown

  • MicroLED performance differentiation per application

  • Key differentiations including modular display and in-display sensors

  • Thin film transistors (TFTs) vs Si-CMOS Microdrivers

  • MicroLED Panel forecasts by application (base and aggressive scenarios)


Status of the MicroLED Industry  Yole Intelligence |  November 2023  Here you can learn about the following key points:  Supply chain overview  Examples of manufacturing ramp-ups  Examples of products and prototypes on the market   OLED improvement and roadmap shifting the goal posts  Smartwatch display modules prices and technology for Apple  TV market: price adoption vs price  4K TV Cost breakdown  MicroLED performance differentiation per application   Key differentiations including modular display and in-display sensors  Thin film transistors (TFTs) vs Si-CMOS Microdrivers  MicroLED Panel forecasts by application (base and aggressive scenarios)  Download Presentation Slides Now

 

3. Key challenges for hybridizing GaN micro-LEDs and CMOS circuits

CEA |  November 2022


Here you can learn about the following key points:

  • Why hybridization of GaN MicroLEDs and CMOS circuits

  • Approaches towards MicroLED and CMOS Intgeration including hybridization, direct bonding and hybrid bonding

  • Flip chip hybridization techniques

  • Microtubes

  • Hybrid bonding

  • Monolithic integration


3. Key challenges for hybridizing GaN micro-LEDs and CMOS circuits  CEA |  November 2022  Here you can learn about the following key points:  Why hybridization of GaN MicroLEDs and CMOS circuits   Approaches towards MicroLED and CMOS Intgeration including hybridizaton, direct bonding and hybrid bonding  Flipchip hybridization techniques  Microtubes   Hybrid bonding   Monolithic integration   Download Presentation Slides Now

 

4. LaserTechnology for the Productin of MicroLED

3D-Micromac |  November 2022


Here you can learn about the following key points:

  • Laser solutions for display manufacturing

  • Laser Lift Off (LLO) Process

  • LLO Process with microMIRA and technical data including throughput, process time, line beam, etc

  • LIFT (Laser Induced Forward Transfer): Throughput Calculations

  • Trimming and Repair on-the-fly

  • microVGA Trim (technical parameters)



4. LaserTechnology for the Productin of MicroLED  3D-Micromac |  November 2022  Here you can learn about the following key points:  Laser solutions for display manufacturing  Laser Lift Off (LLO) Process  LLO Process with microMIRA and technical data including throughput, process time, line beam, etc  LIFT (Laser Induced Forward Transfer): Throughput Calculations  Trimming and Repair on-the-fly  microVGA Trim (technical parameters)  Download Presentation Slides Now


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